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MIL-STD-883G METHOD 2019.7 07 March 2003 1 METHOD 2019.7 DIE SHEAR STRENGTH 1. PURPOSE. The purpose of this test is to determine the integrity of materials and procedures used to attach semiconductor die or surface mounted passive elements to package headers or other substrates. This determination is based on a measure of force applied to the die, the type of failure resulting from this a
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